Paperboard Packaging Seminar, Feb. 21-22

This seminar provides a comprehensive, hands-on exploration of Paperboard Packaging Technologies. Upon completing this program, attendees will be equipped to make valuable contributions to critical packaging decisions. Individuals involved in package design, sales, specification, purchasing, scheduling, quality control, and production management will benefit from this seminar. This seminar is appropriate for all levels of experience and is a must-attend for those who enjoy learning by doing.

Presentations Topics Include:
  • Paperboard Substrates and Applications
  • Paperboard Manufacturing
  • Characteristics of Paperboard
  • Packaging Sustainability
  • Package Design
  • Prepress
  • Printing and Converting
Hands-on Sessions:
  • Packaging Materials
  • Manufacturing Effects
  • Characteristic Test Comparisons
  • Design Breakout Session
  • Printing Comparisons
  • Die Cutting and Scoring

 

SPACE IS LIMITED!

Click here to register.

$995/$895 (Groups 3+)

For More Information or Questions:
Kim Smith - ktrask@clemson.edu · 864.656.4690
Bobby Congdon - rcongdo@clemson.edu · 864.650.2762

Source: The Sonoco Institute of Packaging Design & Graphics