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PACK EXPO 2011 is fast approaching.
For tips on improving packaging performance and cost, register now to attend
no-cost technical briefings at PACK EXPO led by DuPont.
- Consider new ways to improve cost and deliver value to brand owners and consumers.. Hear Dr. Barry Morris, Senior Scientist, speak about "Optimizing Flexible Packaging with Unique Tools from DuPont".
- Stimulate your thinking by learning about the various sealant options offered by DuPont to help create affordable consumer-friendly packaging. Attend "Improving Performance of Easy-Open Packaging", presented by Diane Hahm, Technical Consultant.
- Learn how to strongly bond dissimilar materials in multilayer structures. See examples and a demonstration of a selector guide used for choosing the right grade of DuPont™ Bynel® coextrudable adhesive during "Surmounting the 'Unjoinable' Challenge" by Dr. I Hwa Lee, Senior Technical Fellow.
- Make packaging structures tougher, stronger, more cost effective and better performing by utilizing resin modifiers from DuPont. Listen to Dr. Jose Torradas, Senior Technical Consultant, discuss "Enhancing Package Performance, Value and Sustainability with Modifiers".
A complete schedule of the dates and times of these presentations can be downloaded here.
Come Build the Future of Packaging with Us!
DuPont Packaging & Industrial Polymers
PACK EXPO 2011, Las Vegas
Room N-236, North Hall
September 26-28
packexpo.dupont.com
Source: DuPont Press Release
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